Global CPU Heatsink Market Size, Competition Landscape and Supply Chain Research Report 2025

Research Summary

A CPU heatsink is a crucial component in computer hardware that serves to dissipate heat generated by the central processing unit (CPU) during operation. The CPU is one of the most critical components in a computer, and as it processes data, it generates heat, which can cause the CPU to overheat and potentially malfunction or be damaged. The CPU heatsink is typically made of metal, such as aluminum or copper, and is designed with a series of fins or ridges that increase the surface area for heat dissipation. When the computer is running, the CPU heatsink absorbs the heat from the CPU and disperses it into the surrounding air, aided by a fan mounted on top of the heatsink that enhances airflow. This active cooling process helps maintain the CPU at optimal operating temperatures, ensuring stable and efficient performance. CPU heatsinks are available in various sizes and designs to fit different CPU sockets, making them an essential element in modern computer systems to prevent thermal issues and extend the lifespan of the CPU.

According to WENKH research statistics, the global CPU Heatsink market sales revenue reached  Million USD in 2024 and is expected to reach  Million USD by 2032, with a compound annual growth rate (CAGR) of  % from 2025 to 2032. Among them, the Asia-Pacific CPU Heatsink market has experienced rapid changes in recent years, reaching  Million USD in 2024, accounting for approximately  % of the global market share. It is projected to reach  Million USD by 2032.

The global CPU Heatsink market is highly competitive, with key market players including Corsair, Cooler Master, Noctua, ASUS ROG, ARCTIC, DEEPCOOL, Antec, Asetek, Phononic, NZXT, Thermaltake, CRYORIG, Shenzhen Fluence Technology, Scythe, Swiftech, Nxstek, etc. This report categorizes the competitive landscape of the global CPU Heatsink market into three tiers based on annual revenue, with the top three market players holding approximately  % of the total market share.

This report provides an in-depth analysis of the global CPU Heatsink market, including market size, price trends, market status and future development prospects. It particularly focuses on the market share, product characteristics, pricing, revenue, sales volume and gross profit margin of major manufacturers in the global CPU Heatsink industry. Additionally, this report provides an in-depth analysis of the market status and future development trends of different segments of CPU Heatsink and their downstream application fields.

In terms of data coverage, this report includes extensive time-series data. Historical data spans from 2020 to 2024, providing a solid foundation for analyzing market development trends. The year 2025 is used as a base year to accurately assess the current market landscape, while forecast data extends from 2026 to 2032, using scientific analysis methods and models to offer forward-looking projections and insights into the market's future trajectory. This provides valuable reference information for industry participants and stakeholders.

The report covers regions and countries including North America, Europe, China, Asia Pacific (excluding China), Latin America, the Middle East, and Africa. It particularly focuses on the revenue and sales volume of CPU Heatsink in these regions and countries, as well as the market share of key market players in each region. The report provides an in-depth analysis of the regional distribution and future development trends of the CPU Heatsink market. By considering local policies, this report evaluates the market prospects of CPU Heatsink in each region and country, aiming to help companies gain a comprehensive understanding of the industry characteristics and development potential in different regions, optimize regional business layout, and develop precise market strategies to achieve global development goals.

This report places significant emphasis on data quality and reliability, leveraging a wide range of data sources to ensure accuracy and validity. Primary data collection is conducted through multiple channels, including in-depth interviews with senior corporate executives, industry experts, supply chain participants, and end consumers. This helps to gain insights into corporate strategic planning, industry policies, supply chain dynamics, and user experiences. Secondary data sources cover an extensive range, including authoritative government statistics, customs databases, industry related reports, third-party paid databases, investment research reports, academic studies, corporate financial statements, real-time media updates, and information from international organizations, all of which serve as a solid foundation for data verification and analysis.

Companies Covered

Corsair

Cooler Master

Noctua

ASUS ROG

ARCTIC

DEEPCOOL

Antec

Asetek

Phononic

NZXT

Thermaltake

CRYORIG

Shenzhen Fluence Technology

Scythe

Swiftech

Nxstek

Product Segment

Air Cooling CPU Heatsink

Water Cooling CPU Heatsink

Thermoelectric Cooling CPU Heatsink

Product Application

Gaming PC

Commercial PC

Others

Chapter Scope

Chapter 1: Product Statistical Scope, Product Segmentation Types and Downstream Applications, Overall Market Size, Current Status and Development Prospects

Chapter 2: Global CPU Heatsink Industry Chain Analysis

Chapter 3: Global CPU Heatsink Industry Environment Analysis and Porter's Five Forces Analysis

Chapter 4: Analysis of the Competitive Landscape of Major Companies in the Global CPU Heatsink Market (Market Share, Product Revenue and Sales Volume Comparison, Tier Division, Corporate Expansion and M&A Trends)

Chapter 5: Analysis of Global Major Companies (Company Profiles, Product Features and Product Segment, Product Revenue, Product Sales Volume, Product Average Price, Product Gross Profit Margin and Geographical Sales Share)

Chapter 6: Global CPU Heatsink Product Segment, Downstream Application and Major Regional Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 7: North America CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 8: Europe CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 9: China CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 10: Asia Pacific (excluding China) CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 11: Latin America CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 12: Middle East and Africa CPU Heatsink Product Segment, Downstream Application, and Major Countries Market Size Analysis (Sales Volume, Revenue and Average Price)

Chapter 13: Research Conclusion

Chapter 14: Methodology and Data Source

Purpose and Value of the Report

Market Trend Insights: Analyze industry trends, market dynamics, and future growth potential to help companies forecast changes and develop strategic plans.

Competitive Landscape Analysis: Understand key players' revenue segmentation, strategies, market share, and business models to guide competitive decisions.

Investment Decision Support: Provide feasibility analysis through market size, growth rate, demand trends, and potential risks for informed investment decisions.

Target Customer and Demand Analysis: Examine consumer behavior, purchasing preferences, and pain points to optimize products and improve market penetration.

Policy and Regulatory Insights: Interpret relevant industry policies to ensure compliance and mitigate regulatory risks.

Business Model Optimization: Offer data-driven suggestions for enhancing business models and improving profitability.